Earlier this month, we told you that TSMC has started churning out chips application the 7nm process. This was accepted aftermost anniversary by the company's CEO, CC Wei. The controlling fabricated a animadversion about TSMC alpha bartering assembly of such chips during the firm's technology appointment in Taiwan. The Apple A12 SoC, to admission in the 2018 iPhone models, is congenital application the 7nm action and will be a big contributor to TSMC's 7nm assembly advance in 2018, according to bazaar sources.
The aggregation now has all-embracing assembly accommodation of 12 actor 12-inch wafers, up 9.5% from aftermost year's accommodation of 10.5 actor wafers. TSMC has orders for 7nm chips from 20 companies including AMD, Nvidia and Qualcomm. Best of these orders will be run in the aboriginal bisected of 2019. TSMC will accept 50 dent designs advised for 7nm by the end of the year with best of the tape-outs for AI, GPU, cryptocurrency and 5G chips.
Starting in the third quarter, TSMC will activate accident assembly of 7nm chips application Extreme ultraviolet lithography (EUV) for added absolute carving of designs on wafers. This technology not alone saves time, but additionally helps companies architecture added able and activity able chips. Speaking of which, TSMC affairs accident assembly for chips application the 5nm bulge in the aboriginal bisected of abutting year; accumulation assembly of 5nm chips could alpha as aboriginal as the additional bisected of 2019.
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